LED display basic overview - new packaging LED display - knowledge

LED the new packaging is the product of IC with lights, modular, assembly easier, more efficient. This new packaging format also can effectively improve the micro spacing LED heat dissipation problem, play an important role for the promotion of micro spacing LED display. In order to solve the problem of traditional way encapsulation of heat dissipation and the two difficulties of repair, this paper puts forward a new way of packaging, can effectively solve these problems, and can greatly promote the reliability of the product, make it possible to have extremely high density pixels LED array. Law of development of LED technology is summed up that, can tolerance on smaller LED chip area larger current drive, and get better luminous flux and tropical characteristics, so as to get better performance. New packaging is a kind of based on ball grid array structure and chip level LED new packaging, are shown in figure 1 below. Constant current drive logic chip and LED wafer packaging together, construction mainly include seven parts: epoxy resin filling, LED, IC chip, wafer, support body interconnection layer and solder ball ( Or bumps, welding column) And the protective layer. Interconnection layer through the load with automatic welding, wire bonding and flip chip method to implement the chip and the solder ball ( Or bumps, welding column) Internal connection between, is a key part of encapsulated. LED life is closely related to heat dissipation, high temperature operation for a long time will accelerate the attenuation, reduce the service life. And as the temperature increases, the LED light color performance also has obvious changes, color offset, color distortion, further affect the quality of the LED display. The new packaging form, will use tin ball and cooling channel to assist cooling heat dissipation, and the best way to increase the heat dissipation is the use of heat dissipation tin ball. Heat dissipation tin ball is directly installed on the chip directly under the base board of tin ball, tin can borrow the ball directly upload heat on PCB, and to reduce the thermal resistance of the air. In order to make the heat to the ball more quickly, can use cooling channels through the substrate. The application of new packaging way to drive IC manufacturers and LED packaging manufacturer integrating resources, and that makes it possible to micro spacing LED display promotion.