COG is the abbreviation of English 'Chip On Glass, Chip through ACF (
Anisotropic Conductive Film of Anisotropic Conductive Film)
Be directly dependend on the glass.
This kind of installation method can greatly reduce the volume of the entire LCD module, and lower cost than the TAB, and easy to mass production, is suitable for the LCD consumer electronic products, such as: mobile phones, pdas, MP3 players and other portable electronic products.
This kind of installation method under the impetus of the IC manufacturers, is now the main connection mode of the IC and LCD.
COB is the abbreviation of English 'Chip On Board, the Chip is dependend (
On the PCB, which can greatly reduce the volume of module, at the same time also can reduce the cost in terms of price.
Because the LCD control IC manufacturers and related chip production are falling on QFP (
A kind of SMT type IC, four sides have feet)
Production of packaging, therefore, in the future in the traditional way of SMT products will be gradually replaced.
A: the new type lattice LCD module models JLX19296G - 192 * 96
The next one: 380 electronic to launch its first JLX19264G - vertical screen LCD module